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Small double sputter source magnetron sputtering coater

CY-MSP210S-RFD small dual-target magnetron sputtering coating equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply and an RF p
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Product Details

CY-MSP210S-RFD small dual-target magnetron sputtering coating equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply and an RF power supply. The DC target can be used for sputtering of metals and other conductive materials. The RF power supply can be used for sputtering of various non-metals and metal oxides. The equipment vacuum system adopts all imported vacuum pumps, with fast pumping speed, high ultimate vacuum and excellent vacuum performance. The equipment has compact structure, perfect functions and easy to use. It is very suitable for various coating tests.

Technical parameters of magnetron sputtering coating equipment:
 Sample stage Size φ150mm
  Rotating speed 0-20 adjustable
  Heating Up to 500℃
 Magnetron sputtering target Quantity 2” x2 dual targets share a baffl
 Vacuum chamber Chamber size φ210mm x 230mm
  Chamber material SS304 stainless steel
  Observation window φ40mm
  Opening method Front door
 Vacuum system Mechanical pump Imported oil-free diaphragm pump
  Pumping interface KF16
  Molecular pump Imported molecular pump
  Pumping interface KF40
  Exhaust interface KF16
  Vacuum measurement Resistance gauge + ionization gauge
  Ultimate vacuum 1.0E-3Pa
  Pumping rate Oil-free pump 0.49L/s    Molecular pump: 40L/S
  Power supply AC 220V 50/60Hz
  Quantity

DC power supply x1

RF power supply x1

  Maximum output power

DC power supply 500W

RF power supply 500W

 Other Supply voltage AC220V, 50Hz
  Total power 2kW
  Overall size 550mm x 550mm x1100mm
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