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8 Precision Auto Lapping and Polishing Machine with Two Work Stations HS- EQ-Unipol-802

Basic InfoModel NO.: HS-EQ-Unipol-802Structure: DesktopCertification: CE, ISOType: Lapping MachineTrademark: CYKYSpecification: polishing machineCustomized: Non-CustomizedMaterial: SteelApplication: School, LabProduct Name: Lapping and Polishing MachineTransport Package: Wooden
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Product Details

Basic Info
Model NO.: HS-EQ-Unipol-802
Structure: Desktop
Certification: CE, ISO
Type: Lapping Machine
Trademark: HS
Specification: polishing machine
Customized: Non-Customized
Material: Steel
Application: School, Lab
Product Name: Lapping and Polishing Machine
Transport Package: Wooden Case
Origin: China

Product Description
8" Precision Auto Lapping and Polishing Machine with two work stations HS- EQ-Unipol-802
Description of the auto lapping and polishing machine:HS-EQ-UNIPOL-802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. Combining with flat sample holder (included), the three-hole metallographic sample holder (optional), and precision thinning fixture (optional), the Unipol 802 can lap and polish various samples automatically.


Specification of the auto lapping and polishing machine:

 PowerAC 110V and 208-240V (50/60Hz) switchable for worldwide operation.
 FeaturesOne cast iron plate for lapping and one cast aluminum plate for polishing.
Two rocking workstations with wafer holders and condition rings can be controlled independently for polishing 2 pcs of 3" wafers in one running.
 Super-Flat 8" Lapping PlateFlatness < 2.5 micron="">
 Precision Rotating ShaftRunning Off < 5 micron="">
 Aluminum CaseHeavy Duty Cast with Bright Painting (Color: Black)
 Two Work Stations Rocking Speed8&deg; Rocking with adjustable speed of 0 - 20 rocking / minute
 Two Flat Sample Holders80 Dia. x 35 T mm for carrying<3" diameter="" wafer="">
 Two Condition Rings95 O.D. x 88 I.D. x 32 T mm
 Master Plate Speed Range0 ~~ 125 rpm variable with digital display
 Operation Timer0 - 99 hours
 Motor300 W high torque DC motor
 Dimensions525 L x 350 W x 325 H (mm)
 Net Weight120 lbs
 Optional PartsAutomatic Slurry Feeder 2" Polishing Fixture for Precision / Automatic Thinning and Polishing
Polishing Sample Holder with Three 1" Holes for Metallography 8'' high purity ceramic lapping plate
 WarrantyOne year limited with lifetime support Rusting and damage due to improper storage condition or maintenance are not covered by warranty
 ComplianceCE Certified
 Package Dimensions40" x 38" x 30"
 Shipping Weight160 lb
 ApplicationsPolishing machine applications