DC/RF Dual-Head High Vacuum Magnetron Plasma Sputtering System with Thickness Monitor

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Product Details

Dual-Head Magnetron Plasma Sputtering system / Magnetron Sputter Coater
HS-VTC-600-2HD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. This coater is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE etc. at low cost.

Specification

Input Power	220VAC 50/60Hz, single phase 2000W (including pump)
Source Power	Two sputtering power sources are integrated into one control box DC source: 500W for coating metallic materials RF source: 600W with automatching for coating non-metallic materials ( Center) Compact 300 RF source is available at extra cost
Magnetron Sputtering Head	Two 2" Magnetron Sputtering Heads with water cooling jackets are included One is connected to RF power supply for no-conductive materials Another is connected to DC sputtering power source for coating metallic materials Target size requirement: 2" diameter Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets One stainless steel and one Al2O3 ceramic targets are included for demo testing Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads Customized coater: Two DC head without, RF sputtering, RF head without DC sputtering, 3 RF head are available upon request
Vacuum Chamber	Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel Observation Window: 100 mm diameter Hinged type cover on top with air spring sport makes target exchange easy
Sample Holder	Sample holder size: 140mm dia. for. 4" wafer max (also can be designed as your requirement) Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C
Gas Flow Control	Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in Flow rate: 200 ml/min max. Flow rate is adjustable on the 6" touch screen control panel
Vacuum Pump Station	High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed Mobile pump station is included and the compact sputtering coater can be put on top of station Max. vacuum level: 10^-6 torr with chamber baking
Thickness Monitor	One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å LED Display Unit outside chamber can:5 pcs quartz sensors (consumable) are included Input material to be coated according to data base included Display total thickness coated and coating speed Water cooling is required
Overall Dimensions	L1300mm× W660mm× H1200mm
Net Weight	160 kg
Warranty	One years limited warranty with lifetime support
Application Note	In order to remove oxygen from the chamber, suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O