3 Heads Compact 1” RF Plasma Magnetron Sputtering Coater, with DC Magnetron Sputtering Option

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Product Details

HS-VTC-3RF is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. DC magnetron sputtering option is available upon request for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurations.

SPECIFICATIONS

Input Power	●Single phase 220 VAC, 50 / 60 Hz ●1000 W (including vacuum pump and water chiller)
Power Source	●13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads ●Load range: 0 - 80 adjustable. Tuning range: -200j - 200j adjustable ●The rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched "in the plasma" (no breaking of vacuum and plasma during a multilayer process) ●With a DC power supply, the coater can be easily modified into 1" DC sputtering sources for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurations ●Optional 300 W auto-match RF generator is available at extra cost
Magnetron Sputtering Head	●Three 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps ●RF cable replacement can be purchased at CYKY ●One manually operated shutter is built on the flange ●One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads
Sputtering Target	●Target size requirement: 1" diameter x 1/8" thickness max ●Sputtering distance range: 50 - 80 mm adjustable ●Sputtering angle range: 0 - 25° adjustable ●1" diameter Cu target and Al2O3 target are included for demo testing ●Various oxide 1" sputtering targets are available upon request at extra cost ●For target bonding, 1 mm and 2 mm copper backing plates are included.
Vacuum Chamber	●Vacuum chamber: 256 mm OD x 238 mm ID x 276 mm Height, made of high purity quartz ●Sealing flange: 274 mm Dia. made of Aluminum with high-temperature silicone O-ring ●Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber ●Max vacuum level: 1.0E-5 Torr with optional turbo pump and chamber baking
Sample Holder	●Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover ●Sample holder size: 50 mm Dia. for. 2" wafer max ●Rotation speed: 1 - 10 rpm adjustable for uniform coating ●The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller
Vacuum Pump	●KF40 vacuum port is built in for connecting to a vacuum pump. ●Vacuum level: 1.0E-2 Torr with included dual stage mechanical pump 1.0E-5 Torr with optional turbo pump
Size	540 mm L x 540 mm W x 1000 mm H
Net Weight	60 kg
Compliance	CE approval
Warranty	One years limited warranty with lifetime support