Vacuum magnetron sputtering system

Vacuum magnetron sputtering system is used for the preparation of novel thin film materials such as nanometer single-layer and multi-layer functional film, hard film, metal film, semiconductor film and dielectric film. It can be widely used in the research and production of thin film materials in co

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Product Details

Vacuum chamber		Cylindrical front opening structure, size dia. 450×400mm
Vacuum system configuraition		Compound molecular pump, mechanical pump, pneumatic gate valve, imported SMC cylinder throttle valve
Ultimate pressure		≤6.6*10-6 Pa(after baking and degassing)
Vacuum recovery system		It can reach 6.6x10-4pa in 25 minutes(start pumping after short exposure to air and filled with dry helium)
Magnetron target unit		Three sets of permanent magnetic target; target size dia. 60mm (one of those can be used for sputtering ferromagnetism materials); Each target rf sputtering is compatible with dc sputtering.Water cooling within the target; The sample centers of the three targets can fold upward together. The distance between target and sample is adjustable from 90 to 130mm. Each target is equipped with imported SMC rotary pneumatic baffle
Single substrate heating table	Sample size	dia. 4 inches
	Mode of motion	Substrate rotates continuously, rotation speed 0-30 rpm
	Heating	Heated by imported heating wire, max heating temperature 600℃±1℃
	Battle format	Imported SMC angle air cylinder control
Gas circuit system		2-circuit mass flow controller
Computer control system		Fully automated control by PLC+IPC+touch screen
Optional accessories		Film thickness gauge, air pump, cooling water circulator
Floor Space	Main unit	1000×1800mm²
	Electric cabinet	900×600mm²

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